ㆍ▷ COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
ㆍ▷ PICMG COM.0 R3.0 Type 6 module with Hexacore i7/Xeon and Quadcore i3
ㆍ▷ Up to 48GB Dual Channel DDR4 at 2133/2400MHz
ㆍ▷ Three DDI channels, one LVDS (or 4 lanes eDP), supports up to 3 independent displays
Features
▷ PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core
Intel® processors
▷ Up to 48GB Dual Channel DDR4 at 2133/2400MHz
▷ Three DDI channels, one LVDS (or 4 lanes eDP), supports up to
3 independent displays
▷ One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD &
Intel® Optane™ Memory Technology support)
▷ GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0
▷ Supports Smart Embedded Management Agent (SEMA) functions
Specification & Introduction
▷ CPU
Mobile 8th Generation Intel Xeon® and Core™ Processors - 14nm process
Xeon® E-2176M, 2.7 (4.4)GHz, 12MB. 45W (35W cTDP), 6C/GT2
Core™ i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2
Core™ i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2
Core™ i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2
▷ Memory
2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets
(Xeon® paired with CM246 supports both ECC and non-ECC memory)
(48GB is build support)
▷ Embedded BIOS
AMI EFI with CMOS backup in 32MB SPI BIOS with Intel® AMT 12.0 support
▷ Cache
12MB for Xeon®, 9MB for Core™ i7, 8MB for Core™ i5
6MB for Core™ i3
▷ Chipset
CM246 (supports ECC memory and Intel® AMT)
QM370 (supports Intel® AMT )
HM370 (no support for Intel® AMT )
▷ Expansion Busses
PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3)
6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5
2 PCI Express x1 (Gen3); CD connector, Lane 6/7
LPC bus, SMBus (system), I2C (user)
▷ SEMA Board Controller
Supports: voltage/current monitoring, power sequence debug support,
AT/ATX mode control, logistics and forensic information, flat panel control,
general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan
control
▷ Debug Headers
40-pin multipurpose flat cable connector for use with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power
testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
Ordering Information
▷ Express-CFE-E-2176M
Basic COM Express Type 6 module with Intel® Xeon® E-2176M
(6C/GT2), CM246 chipset, supports ECC/non-ECC
▷ Express-CF-i7-8850H
Basic COM Express Type 6 module with Intel® Core™ i7-8850H
(6C/GT2), QM370 chipset
▷ Express-CF-i5-8400H
Basic COM Express Type 6 module with Intel® Core™ i5-8400H
(4C/GT2), QM370 chipset
▷ Express-CF-i3-8100H
Basic COM Express Type 6 module with Intel® Core™ i3-8100H
(4C/GT2), HM370 chipset