제품소개

제품소개

cExpress-BL

ㆍ▷ COM Express Compact Size Type 6 Module with 5th Gen Intel Core i7/i5/i3 Processors (formerly codename: Broadwell)

ㆍ▷ Up to 32GB Dual Channel DDR3L at 1600/1333 MHz

ㆍ▷ Two DDI channels, one LVDS supporting 3 independent displays

ㆍ▷ Dual channel 18/24-bit LVDS (or optional eDP)

Data sheet

Features

▷ 5th Generation Intel® Core™ i7/i5/i3 and Celeron® SoC
▷ Up to 32GB DDR3L at 1600MHz
▷ Two DDI channels, one LVDS supporting 3 independent displays
▷ Dual channel 18/24-bit LVDS (or build option eDP)
▷ GbE, four PCIe x1 or 1 PCIe x4
▷ Four SATA 6 Gb/s, two USB 3.0, six USB 2.0
▷ Supports Smart Embedded Management Agent (SEMA®) functions
▷ Extreme Rugged operating temperature: -40°C to +85°C 
    (build option)

Specification & Introduction
 Ethernet
    Intel® MAC/PHY: i218LM (Enterprise SKU) with AMT 10 support
    Interface: 10/100/1000 GbE connection
 I/O Interfaces
    USB: 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)
    SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3) 
    Serial: 2 UART ports COM1/2 with console redirection
    GPIO: 4 GPO and 4 GPI
 Super I/O
    Supported on carrier if needed (standard support for W83627DHG-P)
 TPM
    Chipset: Atmel AT97SC3204
    Type: TPM 1.2 
 Power
    Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5% 
    Wide Input: ATX = 5~20 V / 5Vsb ±5% or AT = 5 ~20V
    Management: ACPI 4.0 compliant, Smart Battery support
    Power States: C1-C6, S0, S4, S3, S5, S5 ECO mode 
    (Wake on USB S3/S4, WOL S3/S4/S5)
    ECO mode: Supports deep S5 mode for power saving 
 Operating Systems
▷ Standard Support
    Windows 7/8.1U 32/64-bit, Linux 32/64-bit
▷ Extended Support (BSP)
    WES7, WE8S, Linux, VxWorks (all support 32/64-bit) 
 Mechanical and Environmental
    Form Factor: PICMG COM.0 Rev 2.1 Type 6
    Dimension: Compact size: 95 mm x 95 mm
▷ Operating Temperature
    Standard: 0°C to 60°C
    Extreme Rugged: -40°C + 85°C (build option)
▷ Humidity
    5-90% RH operating, non-condensing
    5-95% RH storage (operating with conformal coating)
▷ Shock and Vibration
    IEC 60068-2-64 and IEC-60068-2-27
    MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, 
    Table 214-I, Condition D
▷ HALT
    Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Ordering Information

▷ cExpress-BL-i7-5650U 
Compact COM Express® Type 6 module with Intel® Core™ 
i7-5650U at 2.2/3.2 GHz with GT3 level graphics
▷ cExpress-BL-i5-5350U
Compact COM Express® Type 6 module with Intel® Core™ 
i5-5350U at 1.8/2.9 GHz with GT3 level graphics 
▷ cExpress-BL-i3-5010U
Compact COM Express® Type 6 module with Intel® Core™ 
i3-5010U at 2.1 GHz with GT2 level graphics 
▷ cExpress-BL-Celeron®
Compact COM Express Type 6 module with Intel® Celeron®