제품소개

Features

▷ 4 SO-DIMMs, up to 128GB dual channel DDR4 at
    1866/2133/2400MHz ECC (dependent on SoC SKU)
▷ Intel® Xeon® D SoC (up to 16 cores)
▷ Two 10G Ethernet and NC-SI support
▷ Up to 32 PCIe lanes (24x Gen3, 8x Gen2)
▷ GbE, two SATA 6 Gb/s, four USB 3.0/2.0
▷ Supports Smart Embedded Management Agent (SEMA®) 
    functions
▷ Extreme Rugged operating temperature: -40°C to +85°C 
    (build option with selected SoC SKU)

Specification & Introduction

 TPM
    Chipset: Infineon
    Type: TPM 2.0
 Power
    Standard Input: ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5% 
    Wide Input: ATX: 8.5-20V, 5Vsb ±5%; AT: 8.5-20V
    Management: ACPI 5.0 compliant, Smart Battery support
    Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4, 
    WOL S3/S4/S5)
    ECO mode: Supports deep S5 mode for power saving 
 Operating Systems
▷ Standard Support
    Windows 10 (64-bit)
    Windows Server 2012 (64-bit)
    Windows 7 (64-bit)
    Linux (64-bit)
▷ Extended Support (BSP)
    Linux (64-bit)
 Mechanical and Environmental
    Form Factor: PICMG COM.0 Rev 3.0 , Type 7
    Dimension: Basic size: 125 mm x 95 mm
▷ Operating Temperature
    Standard: 0°C to 60°C
    Extreme Rugged: -45°C to +85°C (build option, standard voltage only)
    Note: Extreme Rugged availability dependent on SoC SKU
▷ Humidity
    5-90% RH operating, non-condensing
    5-95% RH storage (and operating with conformal coating)
▷ Shock and Vibration
    IEC 60068-2-64 and IEC-60068-2-27
    MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, 
    Table 214-I, Condition D
▷ HALT
    Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Ordering Information

▷ Express-BD74-D1559
    Basic COM Express Type 7 module with Intel Broadwell-DE 
    D1559, 12 core, at 1.5/2.1GHz, 4 SODIMMs 
▷ Express-BD74-D1539
    Basic COM Express Type 7 module with Intel Broadwell-DE 
    D1539, 8 core, at 1.6/2.2GHz, 4 SODIMMs