제품소개

제품소개

nanoX-EL

ㆍ▷ COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly Elkhart Lake)

ㆍ▷ LPDDR4 with in-band ECC error correction

ㆍ▷ TCC and 2.5GbE with optional TSN

ㆍ▷ PCIe Gen3 lanes, USB 3.2 10Gbps

Data sheet

Features

▷ Quad-core Intel Atom® Processor SoC, Burst Frequency up to 3.0GHz
▷ Intel® Gen11 LP GFX for AI inference based on OpenVINO
▷ In-band ECC, up to 16GB LPDDR4 at up to 4267 MT/s
▷ TCC and 2.5GbE with TSN 
▷ Real-time I/O via ARM Cortex-M7 processor 
▷ USB 3.2 10Gbps

Specification & Introduction

 I/O Interfaces
    USB: 2x USB 3.2/2.0/1.1 (USB 0,1,) and 6x USB 2.0/1.1 (USB 2,3,4,5,6,7)
    SATA: 2x SATA 6Gb/s (SATA 0,1)
        Serial: 2x UART ports with console redirection
    eMMC: eMMC 5.0 (16/32/64GB by build option), functions as boot-up device 
    (TBC) 
    GPIO/SD: 4x GPO and 4x GPI from EC (GPI with interrupt TBC)
    SD/GPIO muxed design, SD is build option by project basis, SD functions as 
    storage device only 
 Super I/O
    Supported on carrier if needed (standard support for W83627DHG-P, other 
    Super I/O supported by project basis)
 TPM (build option)
    Chipset: Infineon
    Type: TPM 2.0 (SPI based, build option by project basis)
 Power
▷ Standard Input
    ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5% 
▷ Wide Input
    ATX: 4.75-20 V / 5Vsb ±5%; or AT: 4.75-20V
▷ Management
    ACPI 5.0 compliant, Smart Battery support
▷ Power States
    S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
▷ ECO mode 
    Supports deep S5 mode for power saving 
 Mechanical and Environmental
    Form Factor: PICMG COM.0: Rev 3.0 Type 10
    Dimension: Mini size: 84 mm x 55 mm
▷ Operating Temperature
    Standard: 0°C to 60°C (storage: -20°C to 80°C)
    Extreme Rugged: -45°C to +85°C 
         (optional, selected SKUs; storage: -40°C to 85°C)
▷ Humidity
    5-90% RH operating, non-condensing
    5-95% RH storage (and operating with conformal coating)
▷ Shock and Vibration
    IEC 60068-2-64 and IEC-60068-2-27
    MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, 
    Table 214-I, Condition D
▷ HALT
    Thermal Stress, Vibration Stress, Thermal Shock and Combined Test 
 Operating Systems
▷ Standard Support
    Windows 10 IOT Enterprise 64-bit, Windows 10 64-bit, Yocto Linux 64-bit, 
    VxWorks 64-bit (TBC), Ubuntun (TBC)
▷ Extended Support (BSP)
    Yocto project based Linux 64-bit

Ordering Information

▷ nanoX-EL-x6425E-2G
    COM Express Mini Type 10 module with Intel Atom® x6425E, 
    2GB memory 
▷ nanoX-EL-x6413E-2G
    COM Express Mini Type 10 module with Intel Atom® x6413E, 
    2GB memory 
▷ nanoX-EL-x6211E-2G
    COM Express Mini Type 10 module with Intel Atom® x6211E, 
    2GB memory 
▷ nanoX-EL-x6200FE-2G
    COM Express Mini Type 10 module with Intel Atom® X6200FE 
    (no GPU), 2GB memory 
▷ nanoX-EL-x6425E-4G
    COM Express Mini Type 10 module with Intel Atom® x6425E, 
    4GB memory