제품소개

제품소개

nanoX-AL

ㆍ▷ COM Express Mini Size Type 10 Module with Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)

ㆍ▷ Multiple PCIe x1 Gen2 (configurable to x2, x4), GbE

ㆍ▷ Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz

ㆍ▷ Newest Intel® Gen9 Low Power graphics, Up to 4k resolution and H.265 codec

Data sheet

Features

▷ Intel Atom® E3900 series (formerly Apollo Lake) and 
    Pentium®/Celeron® SoC, supporting full virtualization (VT-d/VT-x) 
▷ Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz
▷ Newest Intel® Gen9 Low Power graphics, up to 4k resolution and 
    H.265 codec
▷ Multiple PCIe x1 Gen2 (configurable to x2, x4), GbE
▷ Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0 
    (build option)
▷ Supports Smart Embedded Management Agent (SEMA) functions
▷ Extreme Rugged operating temperature: -40°C to +85°C 
    (build option for E3900 series SKUs)

Specification & Introduction

 I/O Interfaces
    USB: 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)
    USB OTG support on USB 2.0 port 7 with Yocto Linux
    SATA: Two ports SATA 6Gb/s (SATA0,1) 
    Serial: 2 UART ports
    eMMC: eMMC 5.0 (8/16/32GB, build option)
    GPIO/SD: 4 GPO and 4 GPI
    SD signal is a build option supported by project basis 
 Super I/O
    Supported on carrier if needed (standard support for W83627DHG-P) 
 TPM (build option)
    Chipset: Infineon
    Type: TPM 2.0
 Power
    Standard Input: ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5% 
    Wide Input: ATX: 4.75-20 V, 5Vsb ±5%; AT: 4.75-20V (Standard Temp. only)
    Management: ACPI 5.0 compliant, Smart Battery support
    Power States: C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL 
    S3/S4/S5)
    ECO mode: Supports deep S5 mode for power saving 
 Mechanical and Environmental
    Form Factor: PICMG COM.0 Rev 2.1, Type 10
    Dimension: Compact size: 84 mm x 55 mm
▷ Operating Temperature
    Standard: 0°C to 60°C
    Extreme Rugged: -45°C to +85°C (build option with E39XX SoC SKUs)
▷ Humidity
    5-90% RH operating, non-condensing
    5-95% RH storage (and operating with conformal coating)
▷ Shock and Vibration
    IEC 60068-2-64 and IEC-60068-2-27
    MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 
    214-I, Condition D
▷ HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test 
 Operating Systems
▷ Standard Support
    Windows 10 64-bit, Yocto project based Linux 64-bit, VxWorks 64-bit
▷ Extended Support (BSP)
    VxWorks 64-bit 

Ordering Information

▷ nanoX-AL-E3950-2G 
    Mini COM Express Type10 with Intel Atom® E3950 (4C), 2G 
    memory 
▷ nanoX-AL-E3940-2G 
    Mini COM Express Type10 with Intel Atom® E3940 (4C), 2G 
    memory 
▷ nanoX-AL-E3930-2G
    Mini COM Express Type10 with Intel Atom® E3930 (2C), 2G 
    memory 
▷ nanoX-AL-N4200-2G
    Mini COM Express Type10 with Intel Pentium® N4200 (4C)
▷ nanoX-AL-N3350-2G
    Mini COM Express Type10 with Intel Celeron® N3350 (2C)